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This is an archived article that was published on sltrib.com in 2014, and information in the article may be outdated. It is provided only for personal research purposes and may not be reprinted.

Boulder, Colo. • For the Swiss and the Germans, the wallet is getting heavy. This year, the Vatican plans to send the largest ever group of Swiss guards to the Holy See, where the guards will protect the pope, host visiting dignitaries and have a seat at the table for the conclave to elect the next pope.

The Vatican will accept applications from the Swiss Guards Association beginning next year. The work in Rome will allow the guards, which include a 50-person security force,

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Khatta Meetha (2010) Hindi Movie Trisha Krishnan, Akshay Kumar Complete Score Songs Telly Kumar, Lal Aaj �- Mp3  .The present invention relates to a polishing apparatus and, more specifically, to a polishing apparatus having a mechanism for delivering a polishing pad to a polishing table.
One conventional polishing apparatus having a mechanism for delivering a polishing pad is described in Japanese Laid-Open Patent Publication No. 5-219617. The disclosed polishing apparatus is designed to polish a semiconductor wafer. In particular, the polishing apparatus includes a polishing table, a polishing pad, a pressure application mechanism, and a pad shifting mechanism. The polishing table has a rotational turntable and a wafer holding plate that rotates together with the turntable. The polishing pad is affixed to the holding plate. The pressure application mechanism includes a pair of pressure application rolls for applying a pressure to the wafer being polished, and a polishing pad supporting member for supporting the polishing pad, which is being used for polishing the wafer. The pad shifting mechanism is used for shifting the polishing pad in an axial direction and is designed to move the polishing pad in the axial direction in response to the rotation of the holding plate and the turntable.
The polishing apparatus described above is mainly used to polish semiconductor wafers. Such a polishing apparatus is designed to polish the front side and the back side of semiconductor wafers concurrently to produce a higher level of throughput. However, in order to polish the front side and the back side of semiconductor wafers concurrently, the wafer holding plate must be rotated about its vertical axis. Further, the pad shifting mechanism must be moved in a horizontal direction. Therefore, to polish the semiconductor wafers, the polishing apparatus described above is necessitated to have a large size and complicate structure.
It is a general object of the present invention to provide an
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