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The results of CGGA and TCGA dataset.
3.3. In silico analysis
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According to the results of CGGA and TCGA dataset, we screened the dysregulated genes from CGGA and TCGA datasets through online analysis. As shown in Figure [2](#F2){ref-type=”fig”}, we found upregulated genes in the following 3 main categories: cytokine-cytokine receptor interaction, the TNF signaling pathway, and the IFN-γ signaling pathway. Meanwhile, the downregulated genes included prostaglandin-endoperoxide synthase 2, vesicle transport, the TGF-β signaling pathway, etc.
{#F2}
3.4. OS and DFS analysis
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We used survival R package to analyze the prognostic significance of CD276 and found that low expression of CD276 was significantly correlated with poor overall survival (OS) (*P* = .019) and disease-free survival (DFS) (*P* \
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The technology of the disclosure relates generally to power switching devices and power transmission and switching methods, and particularly to phase-controlled high-side switches and to phase-controlled high-side switching in electrical power transmission and switching.
II. Background
Electrical power supply systems are commonly used to supply power to electrical devices, such as motors, lamps, and other loads. Electrical power transmission and switching has, in the past, been accomplished using low-voltage and low-current power switches, transformers, and/or inductors, as well as electrical power transmission lines to transfer electrical power from a power source to a load. In certain applications, however, it is desirable to use higher-voltage and higher-current switching techniques to allow for high-speed operation and to take advantage of improved efficiencies afforded by higher switching voltages and currents. These higher switching voltages and currents, however, tend to induce higher-frequency switching currents that can interfere with the operation of other devices in the power supply system. For example, these higher-frequency switching currents induce power transients on the power transmission and switching lines that can cause voltage drops and/or phase shifts in the signals that traverse the power transmission lines, thereby causing communication errors and other operational problems.
One technique used to reduce the effects of these higher-frequency switching currents is to use switching devices that only switch when the current flowing through the switching device is in a specific direction. For example, if the current flowing through the switching device is in a positive direction, a positive voltage is built-up across the switching device, and if the current flowing through the switching device is in a negative direction, a negative voltage is built-up across the switching device. This positive or negative voltage can be used to turn on or off the switching device by driving one or more power semiconductors connected to the switching device with the positive or negative voltage. Examples of such switching devices are described in U.
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I hope this video helps you figure it out.A small-sized printed circuit board has a wiring pattern and other components mounted thereon. A printed circuit board includes a plurality of printed circuits and wiring patterns therein.
As high integration of the semiconductor devices is advanced and there are increasing demands for reduction of size and high speed of the printed circuit board, copper plating, which is a more copper-rich plating, is widely used for the wiring pattern, but there are various problems in formation of a copper wiring pattern and reliability of an electric connection thereof with the semiconductor device.
A typical printed circuit board comprises a conductive wiring pattern or circuit and an insulating substrate. The conductive wiring pattern is provided in a surface of the insulating substrate by forming a conductive layer such as Cu layer on the surface of the insulating substrate and the conductive layer is selectively etched to form the wiring pattern.
FIG. 5 is a cross-sectional view showing a process for manufacturing a conventional printed circuit board. A conductive layer 1 of Cu is formed on the surface of an insulating substrate 11 made of a resin such as an epoxy resin, a polyimide resin, or a phenol resin by plating. The resist film 2 is formed on the conductive layer 1 by coating and then exposure and development is performed. The resist film 2 is partially removed by etching to form an opening 2a. A conductive layer 3 is formed on the entire surface by plating and then the resist film 2 is removed.
The conductive layer 3 is used as a base for providing an insulating layer 12 on the substrate 11 and the conductive layer 3 is selectively etched to form a wiring pattern 3. The wiring pattern 3 is provided with an undercoat insulating layer 12 formed in the opening 2a of the resist film 2, but the undercoat insulating
